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US Patent Issued to Mitsubishi Electric on Nov. 3 for "Method for manufacturing semiconductor device, semiconductor device, electric power conversion device, and mobile body" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,895, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo). "Method for manufacturing semiconductor device, semiconductor devi... Read More


US Patent Issued to Infineon Technologies on Nov. 3 for "Power semiconductor module arrangement" (Hungarian Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,896, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Power semiconductor module arrangement" was invented ... Read More


US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 3 for "Terminal structure and wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,897, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Terminal structure and wiring substrate" was in... Read More


US Patent Issued to QUALCOMM on Nov. 3 for "Device comprising wall pillar interconnects" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,898, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Device comprising wall pillar interconnects" was invented by Yujen Chen (... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,899, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyungdo... Read More


US Patent Issued to QUALCOMM on Nov. 3 for "Embedding vectors for three-dimensional modeling" (Dutch, British, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,342, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Embedding vectors for three-dimensional modeling" was invented by Florian... Read More


US Patent Issued to Yamaha Robotics on Nov. 3 for "Method for generating three-dimensional diagram of object, three-dimensional diagram generation apparatus and three-dimensional shape inspection apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,345, issued on Nov. 3, was assigned to Yamaha Robotics Co. Ltd. (Tokyo). "Method for generating three-dimensional diagram of object, three-d... Read More


US Patent Issued to HON HAI PRECISION INDUSTRY on Nov. 3 for "Method for scoring surround view monitor, electronic device and storage medium" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,347, issued on Nov. 3, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei, Taiwan). "Method for scoring surround view monitor, ... Read More


US Patent Issued to ONTACT HEALTH on Nov. 3 for "Method for standardizing medical images and device for using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,148, issued on Nov. 3, was assigned to ONTACT HEALTH Co. LTD. (Seoul, South Korea). "Method for standardizing medical images and device for ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Method, electronic device, and storage medium for processing image by using convolution neural network" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,149, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method, electronic device, and storage medium ... Read More